Hybrid heatsinks combine the thermal conductivity of copper with the advantages of aluminium
Copper and cold-sprayed hybrid heat sinks exhibit nearly identical thermal performance and significantly outperformed the aluminum heat sink. This outcome underscores the significance of rapid heat dispersion along the base. Concurrently, the hybrid heat sink, despite its enhanced performance, weighed less than the pure copper heat sink.
It is true that the production of hybrid heat sinks using the cold spraying method comes with higher costs compared to readily available aluminum heat sinks. However, the addition of a copper layer to an aluminum heat sink reduces its thermal resistance by 48%. This reduction directly impacts production expenses, as the semiconductor area can be reduced by as much as 94%.
Moreover, the cold spray process demonstrates a copper powder deposition efficiency of 95% (inclusive of overspray) and deposition rates of 10 kg/h. These figures highlight the potential of the cold spray process for achieving cost-effective large-scale industrial production.
- Cold sprayed hybrid heat sinks have excellent mechanical and physical properties
- Electrical conductivity IACS up to 98%
- Deposition efficiency > 98 %
- Porosity < 0.5 %
- Feed rate 10 kg/h
- Hardness – 107 HV
- Ultimate tensile strength – 285 MPa
- Thermal conductivity 368 W/mK
- Gas tightness < 1 × 10-7 mbar-l/s
- Elongation 25%
- Minimum layer thickness < 50 µm
- Maximum layer thickness - no limit